View LM1114-18BM3-0-T2-G_8921862.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

cystech electronics corp. spec. no. : c505n3-b issued date : 2003.03.21 revised date : 2014.01.03 page no. : 1/15 lm1114bm3/n3/a3 cystek product specification low dropout cmos voltage regulators lm1114b features applications maximum output current 250ma battery powered equipment highly accurate : output voltage+/-2% palmtops low power consumption : typ. 2a portable cameras and video recorders small input/output differential: reference voltage sources 0.45v typ at 160ma( 2.5v, 3.0v, 3.3v, 3.6v) 0.35v typ at 200ma(vout=5v) pb-free lead plating and halogen-free package product description the lm1114b series is a group of positive voltage out put, three-pin regulators, that provide a high current even when the input/output voltage differ ential is small. low power consumption and high accuracy is achieved through cmos and programmable fuse technologies. the lm1114b consists of a high-pr ecision voltage reference, an error correction circuit, and a current limited output driver. transient response to load varia tions is improved in compar ison to the existing ones. absolute maximum ratings parameter symbol ratings units input voltage vin 12 v output current iout 500 ma output voltage vout vss-0.3 ? vin+0.3 v 500 150 continuous total power dissipation to-92 sot-23 sot-89 p d 500 mw operating ambient temperature topr -40 ?+85 storage temperature tstg -40 ?+125 pin configuration to-92 sot-23 sot-89 vin 1 2 3 vout vss 1 2 3 1 2 3 vss vin vout vss vin vout
cystech electronics corp. spec. no. : c505n3-b issued date : 2003.03.21 revised date : 2014.01.03 page no. : 2/15 lm1114bm3/n3/a3 cystek product specification block diagram voltage current limit reference v v ou v in t s s v in v out v ss typical application circuit
cystech electronics corp. spec. no. : c505n3-b issued date : 2003.03.21 revised date : 2014.01.03 page no. : 3/15 lm1114bm3/n3/a3 cystek product specification ordering information device output voltage package shipping lm1114-1.8 ba3 -0-tb -g 1.8v to-92 (pb-free lead plating and halogen-free package) tape & box / 2k lm1114-1.8 bn3 -0-t1 -g 1.8v sot-23 (pb-free lead plating and halogen-free package) tape & reel / 3k lm1114-1.8 bm3 -0-t2 -g 1.8v sot-89 (pb-free lead plating and halogen-free package) tape & reel / 1k lm1114-2.5 ba3 -0-tb -g 2.5v to-92 (pb-free lead plating and halogen-free package) tape & box / 2k lm1114-2.5 bn3 -0-t1 -g 2.5v sot-23 (pb-free lead plating and halogen-free package) tape & reel / 3k lm1114-2.5 bm3 -0-t2 -g 2.5v sot-89 (pb-free lead plating and halogen-free package) tape & reel / 1k lm1114-3.0 ba3 -0-tb -g 3.0v to-92 (pb-free lead plating and halogen-free package) tape & box / 2k lm1114-3.0 bn3 -0-t1 -g 3.0v sot-23 (pb-free lead plating and halogen-free package) tape & reel / 3k lm1114-3.0 bm3 -0-t2 -g 3.0v sot-89 (pb-free lead plating and halogen-free package) tape & reel / 1k lm1114-3.3 ba3 -0-tb -g 3.3v to-92 (pb-free lead plating and halogen-free package) tape & box / 2k lm1114-3.3 bn3 -0-t1 -g 3.3v sot-23 (pb-free lead plating and halogen-free package) tape & reel / 3k lm1114-3.3 bm3 -0-t2 -g 3.3v sot-89 (pb-free lead plating and halogen-free package) tape & reel / 1k lm1114-3.6 ba3 -0-tb -g 3.6v to-92 (pb-free lead plating and halogen-free package) tape & box / 2k lm1114-3.6 bn3 -0-t1 -g 3.6v sot-23 (pb-free lead plating and halogen-free package) tape & reel / 3k lm1114-3.6 bm3 -0-t2 -g 3.6v sot-89 (pb-free lead plating and halogen-free package) tape & reel / 1k lm1114-5.0 ba3 -0-tb -g 5.0v to-92 (pb-free lead plating and halogen-free package) tape & box / 2k lm1114-5.0 bn3 -0-t1 -g 5.0v sot-23 (pb-free lead plating and halogen-free package) tape & reel / 3k lm1114-5.0 bm3 -0-t2 -g 5.0v sot-89 (pb-free lead plating and halogen-free package) tape & reel / 1k environment friendly grade : s for rohs compliant products, g for rohs compliant and green compound products packing spec, t2 :1000 pcs/tape & reel, 7? reel ; tb : 2000 pcs/ tape & box ; t1 : 3000 pcs/tape & reel, 7? reel product rank, zero for no rank products product name
cystech electronics corp. spec. no. : c505n3-b issued date : 2003.03.21 revised date : 2014.01.03 page no. : 4/15 lm1114bm3/n3/a3 cystek product specification electrical characteristics @v in =5v,ta=25 , c in =1 f(tantalum), c out =1 f(tantalum), unless otherwise noted lm1114-1.8 parameter conditions min typ max units circuit output voltage io=40ma,vin=2.8v 1.764 1.800 1.836 v 1 line regulation vout/ vinvout io=40ma,4v cystech electronics corp. spec. no. : c505n3-b issued date : 2003.03.21 revised date : 2014.01.03 page no. : 5/15 lm1114bm3/n3/a3 cystek product specification load regulation vin=6v,1ma cystech electronics corp. spec. no. : c505n3-b issued date : 2003.03.21 revised date : 2014.01.03 page no. : 6/15 lm1114bm3/n3/a3 cystek product specification characteristic curves @c in =1 f(tantalum), c out =1 f(tantalum) lm1114-3.0 output voltage vs input voltage 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 024681012 vin, input voltage(v) vout, output voltage(v) iout=1ma iout=40ma iout=80ma input-output voltage differential 0 100 200 300 400 500 600 700 800 900 1000 0 50 100 150 200 250 300 iout, output current (ma) vd, voltage differential(mv) supply current vs input voltage 0 0.5 1 1.5 2 2.5 3 3.5 024681012 vin, input voltage(v) iss, supply current(a)
cystech electronics corp. spec. no. : c505n3-b issued date : 2003.03.21 revised date : 2014.01.03 page no. : 7/15 lm1114bm3/n3/a3 cystek product specification lm1114-3.3 output voltage vs input voltage 1.0 1.5 2.0 2.5 3.0 3.5 4.0 024681012 vin, input voltage(v) vout, output voltage(v) iout=1ma iout=40ma iout=80ma input-output voltage differential 0 100 200 300 400 500 600 700 800 900 0 50 100 150 200 250 300 iout, output current (ma) vd, voltage differential(mv) supply current vs input voltage 0 0.5 1 1.5 2 2.5 3 3.5 024681012 vin, input voltage(v) iss, supply current(a)
cystech electronics corp. spec. no. : c505n3-b issued date : 2003.03.21 revised date : 2014.01.03 page no. : 8/15 lm1114bm3/n3/a3 cystek product specification lm1114-5.0 output voltage vs input voltage 3.0 3.5 4.0 4.5 5.0 5.5 024681012 vin, input voltage(v) vout, output voltage(v) iout=1ma iout=40ma iout=80ma input-output voltage differential 0 100 200 300 400 500 600 700 800 0 50 100 150 200 250 300 iout, output current (ma) vd, voltage differential(mv) supply current vs input voltage 0 0.5 1 1.5 2 2.5 3 3.5 024681012 vin, input voltage(v) iss, supply current(a)
cystech electronics corp. spec. no. : c505n3-b issued date : 2003.03.21 revised date : 2014.01.03 page no. : 9/15 lm1114bm3/n3/a3 cystek product specification recommended wave soldering condition product peak temperature soldering time pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of t he package, measured on the package body surface.
cystech electronics corp. spec. no. : c505n3-b issued date : 2003.03.21 revised date : 2014.01.03 page no. : 10/15 lm1114bm3/n3/a3 cystek product specification to-92 taping outline millimeters dim item min. max. a component body height 4.33 4.83 d tape feed diameter 3.80 4.20 d1 lead diameter 0.36 0.53 d2 component body diameter 4.33 4.83 f1,f2 component lead pitch 2.40 2.90 f1,f2 f1-f2 - 0.3 h height of seating plane 15.50 16.50 h1 feed hole location 8.50 9.50 h2 front to rear deflection - 1 h2a deflection left or right - 1 h3 component height - 27 h4 feed hole to bottom of component - 21 l lead length after component removal - 11 l1 lead wire enclosure 2.50 - p feed hole pitch 12.50 12.90 p1 center of seating plane location 5.95 6.75 p2 4 feed hole pitch 50.30 51.30 t over all tape thickness - 0.55 t1 total taped package thickness - 1.42 t2 carrier tape thickness 0.36 0.68 w tape width 17.50 19.00 w1 adhesive tape width 5.00 7.00 - 20 pcs pitch 253 255 h2a h2a h2 h2 d2 a h w w1 h3 h4 h1 l1 l p2 p p1 f1 f2 d1 d t2 t t1
cystech electronics corp. spec. no. : c505n3-b issued date : 2003.03.21 revised date : 2014.01.03 page no. : 11/15 lm1114bm3/n3/a3 cystek product specification reel dimension for sot-23 carrier tape dimension
cystech electronics corp. spec. no. : c505n3-b issued date : 2003.03.21 revised date : 2014.01.03 page no. : 12/15 lm1114bm3/n3/a3 cystek product specification reel dimension for sot-89 carrier tape dimension
cystech electronics corp. spec. no. : c505n3-b issued date : 2003.03.21 revised date : 2014.01.03 page no. : 13/15 lm1114bm3/n3/a3 cystek product specification to-92 dimension *: typical inches m i l l i m e t e r s i n c h e s m i l l i m e t e r s dim m i n . m a x . m i n . m a x . dim m i n . m a x . m i n . m a x . a 0 . 1 7 0 4 0 . 1 9 0 2 4 . 3 3 4 . 8 3 g 0.0142 0 . 0 2 2 0 0 . 3 6 0 . 5 6 b 0 . 1 7 0 4 0 . 1 9 0 2 4 . 3 3 4 . 8 3 h - * 0 . 1 0 0 0 - * 2.54 c 0 . 5 0 0 0 - 1 2 . 7 0 - i - * 0 . 0 5 0 0 - * 1.27 d 0 . 0 1 4 2 0 . 0 2 2 0 0 . 3 6 0 . 5 6 1 - * 5 - * 5 e - * 0 . 0 5 0 0 - * 1.27 2 - * 2 - * 2 f 0 . 1 3 2 3 0 . 1 4 8 0 3 . 3 6 3 . 7 6 3 - * 2 - * 2 note s: 1.dimension and toleran c e based on our s pec. dated apr . 18,2002. 2.controlling dimension: millimeters. 3.maximum lead thickness include s lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.if there is an y q uestion w i th p a ck ing specification or p a cking metho d , please c ont act y our local c y s t ek sales of fice. material: ? lead: pur e tin plated. ? mold compou n d : epoxy resin fa mily , flammabilit y solid burning cla ss: ul94v -0. lm 11 1 4 marking: 3 1 a d b c i 1 e f 2 2 3 device name g h date code v o ltage : 1.8v 18 2.5v 25 3.0v 30 3.3v 33 3.6v 36 5.0v 50 s t yle: pin 1.vss 2.v i n 3.v o ut 3-l ead t o -9 2 plastic pa ckag e cys t ek pa ck a g e code: a 3
cystech electronics corp. spec. no. : c505n3-b issued date : 2003.03.21 revised date : 2014.01.03 page no. : 14/15 lm1114bm3/n3/a3 cystek product specification sot-23 dimension *: typical inches device code voltage : 1.8v 18 2.5v 25 3.0v 30 3.3v 33 3.6v 36 5.0v 50 3-lead sot-23 plastic surface mounted package cystek package code: n3 st y le: pin 1. vss 2.vout 3.vin marking: date code 4 xx millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.1102 0.1204 2.80 3.04 j 0.0032 0.0079 0.08 0.20 b 0.0472 0.0669 1.20 1.70 k 0. 0118 0.0266 0.30 0.67 c 0.0335 0.0512 0.89 1.30 l 0.0335 0.0453 0.85 1.15 d 0.0118 0.0197 0.30 0.50 s 0.0830 0.1161 2.10 2.95 g 0.0669 0.0910 1.70 2.30 v 0.0098 0.0256 0.25 0.65 h 0.0000 0.0040 0.00 0.10 l1 0. 0118 0.0197 0.30 0.50 notes: 1.dimension and tolerance based on our spec. dated feb. 18,2002. 2.controlling dimension: millimeters. 3.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.if there is any question with packing specification or packing method, please contact your local cyctek sales office. material: ? lead: pure tin plated. ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0.
cystech electronics corp. spec. no. : c505n3-b issued date : 2003.03.21 revised date : 2014.01.03 page no. : 15/15 lm1114bm3/n3/a3 cystek product specification sot-89 dimension marking: *: typical inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.1732 0.1811 4.40 4.60 f 0.0583 0.0598 1.48 1.527 b 0.1594 0.1673 4.05 4.25 g 0. 1165 0.1197 2.96 3.04 c 0.0591 0.0663 1.50 1.70 h 0.0551 0.0630 1.40 1.60 d 0.0945 0.1024 2.40 2.60 i 0.0138 0.0161 0.35 0.41 e 0.01417 0.0201 0.36 0.51 notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material: ? lead: pure tin plated. ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance . 3-lead sot-89 plastic surface mounted package cystek package code: m3 e f g c b a 3 2 1 i d h 1114 b style: pin 1. vss 2. vin 3. vout device code date code voltage: 1.8v 18 2.5v 25 3.0v 30 3.3v 33 3.6v 36 5.0v 50

▲Up To Search▲

Price & Availability of LM1114-18BM3-0-T2-G

	To Download LM1114-18BM3-0-T2-G Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .